Trident and Trident General Purpose (Tri-GP) Systems

Miscellaneous Electric Control Components

Programmable Logic Controls, I/O Components and Communication Interfaces

Trident and Trident General Purpose (Tri-GP) Systems

Product Description

Fault tolerant control system for Marine and Offshore applications.:, -Processor: , I.3101 MP Main processor module, II. 2101 MP Baseplate main processor baseplate kit., -Communication module: , I.3201: Communication Module, II.2201: Communication Module Baseplate Kit, -Communications integration module: , I.3211: Communication Integration Module Baseplate Kit, II.2211: Communications Integration Module Baseplate Kit. , III.2211-100: Communications Integration Module Media Adapter., -Analog Input: , I.3351: Analog Input Module., II.2351: Analog Input Baseplate Kit., -Analog Input/Digital Input: , I.3361: Analog Input/Digital Input Module., II.2361: Analog Input/Digital Input Baseplate Kit. , -Analog Output: , I.3481: Analog Output Module, II.2481: AO Module Baseplate Kit., -Analog Output, High-Current: , I.3482: High-Current Analog Output Module., II.2481: AO Module Baseplate Kit., -Digital Input Module: , I.3301: Digital Input Module., II.2301: Digital Input Module, High Resolution., -Digital Input High resolution:, I.3311: Digital Input Module, High Resolution., II.2301: Digital Input Baseplate Kit., -Digital Output: , I.3404: Digital Output Module., II.2401: Digital Output Baseplate Kit., -Digital Output, Low Current: , I.3401: Digital Output Module., II.2401L: Digital Output Baseplate Kit, Low Current., , -Digital Output, Supervised, High Current:, I.3411: Digital Output Module, Supervised., II.2401H: Digital Output Baseplate Kit, High Current., -Solid-State Relay Output: , I.3451: Solid-State Relay Output Module., II.2451: Solid-State Relay Output Baseplate Kit., -Pulse Input, Enhanced: , I.3382: Pulse Input Module, Enhanced, II.2381: Pulse Input Baseplate Kit., -Pulse Input, Enhanced, Hazardous Location:, I.3382: Pulse Input Module, Enhanced., II.2381A: Pulse Input Baseplate Kit, Hazardous Location (Zone 2)., -Various Baseplate Kits:, I.2281: I/O Bus Extender Module Kit., II.2291: I/O Bus Termination Kit, I/O Baseplate., III.2292: I/O Bus termination Kit, MP Baseplate., IV.2302A-F: Digital Input Baseplate Kit, Hazardous Location., V.2342: Analog Input/Digital Input Baseplate Kit, External termination., VI.2342A-F: Analog Input/Digital Input Baseplate Kit, Hazardous Location (Zone 2)., VII.2352A-F: Analog Input Baseplate Kit, Hazardous Location (Zone 2), VIII.2402A-F: Digital Output Baseplate Kit, Hazardous Location (Zone 2), IX.2480A-F: Analog Output Baseplate Kit, Hazardous Location (Zone 2) (Zone 2)., -Miscellaneous:, I.2910: Top End Cap -I/O., II.2911: Bottom End Cap-I/O., III.2912: Top End Cap-MP., IV.2913: Bottom End Cap-MP, V.2920: MP interconnect Assembly., VI.2921: I/O interconnect Assembly., VII.8401: Accessories Kit., VIII.3900064-003: I/O Bus Terminator Kit (Set of 3)., IX.4000212-002: 2feet I/O bus cables., X.4000212-006: 6feet I/O bus cables, XI.4000212-010: 10feet I/O bus cables, XII.3000678-100: I/O Extender Module.,

Product Ratings

Operating temperature: -20 C to +70 C degrees. | Relative Humidity: 5% to 95 % non-condensating. | Input voltage: 24 VDC |

Applicable Standards

IEC 61131-2: 2007; IEC 61508 (2010), IEC 61326-3-1: 2008; IEC61511:2004; IEC 60068-2-1:2007; 60068-2-30: 2007; 60068-2-14 : 2007; 60068-2-6:2007; IEC 61000-4-2:2008; IEC 61000-4-5:2008; IEC 61000-4-6:2008; IEC61000-4-18:2008; IEC 6100-4-3:2008; IEC 61000-4-29:2008.

EN50156-1:2004; EN50178:1998; EN 54-2:1997